TITAN TTC-NK54TZ Low Profile CPU Cooler for Intel LGA 775 with 80mm Silent Fan | 1U/2U Server Cooling
TITAN's TTC-NK54TZ is a premium low profile CPU cooler designed for Intel LGA 775 platforms in 1U/2U servers. With 2 DC heat pipes, 80mm silent cooling fan, and copper base, it delivers superior thermal performance up to 115W TDP in just 39mm height.
1U/2U Intel LGA 775- Low Profile Design CPU Air Cooler with 2 DC Heat Pipes and 80mm Silent Cooling Fan and Copper Base / TDP 115W
TTC-NK54TZ
FreezeZone Pro Cooler: Pro-Level Cooling, Pro-Level Comfort!
TTC-NK54TZ is a CPU cooler that designed for 1U/2U Intel LGA775 platform. Equipped with high-density cooling fins, copper base, and 80mm silent cooling fan, this CPU cooler can strengthen thermal sink of CPU. Offer you an economic choice for computer CPU cooler.
Features
- Low profile design- great for various HTPC cases
Only 39mm height, suitable for low profile case - Super silent CPU fan for silent operation
With 80mm fan, it provides great cooling and silence performance. - High density soldering fins design- enhance heat dissipation
High density soldering cooling fins design for centralizing airflow and circulation to accelerate thermal transfer. - Copper base- increasing heat transfer
Update pure copper base to accelerate heat conductivity.
Applications
- Auanium Canopy fan
- Stand and canopy fan
- Car fan
- Stroller cooling fan
- DIY canopy fan
- Office cooling fan
Specification
- Outline Dimension: 93 x 107x 39 mm
- Fan Dimension: 80 x 80 x 10 mm
- Rated Voltage: 12V DC
- Rated Current: 0.26 A
- Power Consumption: 3.12 W
- Rated Speed: 3550 RPM
- Airflow: 24.71 CFM
- Static Pressure: 0.06 Inch H2O
- Noise Level: < 30.6 dBA
- Connector: 3-PIN
- Bearing Type: Z-AXIS
- Life Time: 60,000 Hours
- UP TO 115W
- For Intel LGA 775
Package Volume
- 1CTN(PCS): 30
- N.W.(KGS): 7.5
- G.W.(KGS): 10.8
- MEAS'T(CUFT): 1.08
MOQ
MOQ: 1000pcs
- Photo Gallery
Equipped with high-density cooling fins, copper base, and 80mm silent cooling fan, this CPU cooler can strengthen thermal sink of CPU.
With 80mm fan, it provides great cooling and silence performance.
Low profile design- great for various HTPC cases. Only 39mm height, suitable for low profile case.
High density soldering cooling fins design for centralizing airflow and circulation to accelerate thermal transfer
Update pure copper base to accelerate heat conductivity.
TITAN high quality CPU cooler
- Files Download
- Related Products
1U/2U AMD Socket- Low Profile Design CPU Air Cooler with 2 DC Heat Pipes and 80mm Silent Cooling Fan and Copper Base / TDP 110W
TTC-NK52TZ
TTC-NK52TZ is a CPU cooler that designed for 1U/2U Intel LGA775 platform. Equipped with high-density...
Details
1U/2U Intel LGA 775- Low Profile Design CPU Air Cooler with 2 DC Heat Pipes and 80mm Silent Cooling Fan and Copper Base / TDP 115W
TTC-NK54TZ
TTC-NK54TZ is a CPU cooler that designed for 1U/2U Intel LGA775 platform. Equipped with high-density...
Details
TITAN RV Fan Series
This is TITAN RV product serous, it will help you to understand the differences.
Download Popular Products
How Can Server Manufacturers Maximize Cooling in 1U/2U Rack Configurations?
The TTC-NK54TZ's ultra-compact 39mm height design solves the critical cooling challenges faced in 1U/2U server environments. By combining high-density cooling fins with a copper base and efficient 80mm fan, this solution delivers 115W TDP cooling capacity while fitting in the most space-restricted chassis. Contact us for volume pricing and custom integration support for your server manufacturing needs.
Engineered for reliability and performance, the TTC-NK54TZ features TITAN's premium Z-AXIS bearing technology that ensures 60,000 hours of continuous operation, making it ideal for mission-critical applications. The copper base maximizes heat conductivity from the CPU, while the strategically designed cooling fins centralize airflow circulation to accelerate thermal transfer. This economic yet high-performance cooling solution is perfect for server manufacturers, data center operators, and system integrators seeking reliable thermal management in compact computing environments without compromising on cooling efficiency or acoustic performance.