Thermal Compound Nano Syringe Grease / Paste / for Heatsink of CPU VGA LED (3g)
TTG-G30030
Take newly nanotechnology, this is a nano thermal conductive grease, features in minimizing nano-greases to improve maximum dissipation of heat generated from VGA, CPU, or LED. Create a more outstanding optimized protection against CPU heat damage and system stability than other standard heat paste / CPU grease.

Features
- Nano-molecular thermal grease to accelerate heatsink
With nano-grease, it can improve heat dissipation of CPU or VGA, providing greatly cooling performance. - Resealable syringe applicator and easy installation
- Compliance with RoHS requirement, provide a non-toxic and safe support.
Specification
- Color: Gray
- Thermal Conductivity: > 4.5 W/m-°C
- Thermal Impedance: < 0.205°C-in2/W
- Specific Gravity: > 2.5
- Operation Temperture: -50 ~ 240°C
Package Volume
- 1CTN(PCS): 400
- N.W.(KGS): 1.2
- G.W.(KGS): 14.1
- MEAS'T(CUFT): 3.5
MOQ
MOQ: 20000pcs
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How Does Nano-Technology Improve CPU Cooling Performance?
TITAN's nano-molecular thermal grease uses particles significantly smaller than traditional compounds, filling microscopic air gaps between your CPU and heatsink with unprecedented efficiency. This results in up to 20% better heat transfer compared to standard thermal pastes, allowing for more stable overclocking and extended component lifespan. Our TTG-G30030 creates a superior thermal interface that maximizes your cooling system's potential without the complexity of liquid metal solutions.
Designed with both performance and convenience in mind, the TTG-G30030 comes in a precision-engineered resealable syringe applicator that allows for precise, controlled application with minimal waste. The non-toxic, RoHS-compliant formulation provides peace of mind for both professional installers and DIY enthusiasts while delivering superior thermal performance. TITAN's nano-grease technology significantly enhances the cooling efficiency of CPUs, VGAs, and LED components, resulting in improved system stability, extended component lifespan, and enhanced overclocking potential compared to standard thermal compounds.